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Aluminum Nitride PCB (AlN)
Aluminum Nitride PCB (AlN) is one of the best performing circuits solutions today for high current or high temperature electronics. Thanks to its incredible thermal conductivity (170 W/mK) and dielectric strength combined with its low thermal expansion (CTE <4 ppm/C) it is used today in many application ranging from high power LEDs and lasers to high current switches, ultra low temperature vacuum chamber electronics (e.g. quantum computing) and many many more … . Furthermore it has all the additional benefits other ceramic material have like rigidity, resistance against environments & chemical hazards and 0% water absorption.
The main reasons Aluminum Nitride is chosen over other printed circuit boards is:
- Superior thermal conductivity 170W/mK
- Strong dielectric
- High operating temperature >350ºC possible
- Low expansion coefficient <4 ppm/C
- Smaller package size due to integration
- Hermetic packages possible, 0% water absorption
- Limited to no outgassing
At CERcuits, we supply both Aluminium Nitride PCB (AlN) processed by thick film process (Silver/silver palladium metalization) as well as Direct Plated Copper Technologies (DPC), with copper tracks and pads.
We offer online quoting and ordering and have a solution for you whether you are in your development phase, doing research (C-Proto) or moving towards mass production (C-Production).
Explore our aluminum nitride PCB solutions below
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C-PROTO
Quick turn. Starting at 1 piece!
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The perfect solution for fast turn development, research, prototyping and low to volume programs. Advised for 1-5 panels.
- Max dimensions 90″x80mm | 3.5″ x 3.1″
- Copper (1oz | 35um) or Silver (20um +/- 5) metallization
- Layers: Single sided only (double sided coming soon)
- Thicknesses: 0.38mm, 0.5mm, 0.76mm, 1mm | 0.015″, 0.02″, 0.03″, 0.04″
- Vias PTH (filled or not filled)
- Solder mask: Green, Black & White, Blue (standard or encapsulant)
- Ident: coming soon, laser engraving possible
- Finish: Immersion Tin, Silver, ENIG (gold), ENEG (advised for gold wire bonding)
- Track width: >= 100um
- Spacing: >= 100um
- Delivery in single units or panel with/without laser scribing (more info)
More information:
Design delivery format: Gerber, dxf, dwg, step, pdf, ai, ODB++
Lead time: 5-15 working days. 2-3 days possible
Assembly: Reflow/SMT advised, through hole, wire bonding.
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C-PRODUCTION
More options, higher volume
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Full specifications available. mostly chosen for medium to higher volume programs. Advised from 5-100 panels
- Max dimensions 115″x115mm | 4.5″x4.5″
- Copper, Silver or Silver-palladium metallization
- Layers: single layer – up to 4 layers
- Thicknesses: 0.38mm, 0.5mm, 0.635mm, 0.76mm, 1mm, 1.5mm | 0.015″, 0.02″, 0.025″, 0.03″, 0.04″, 0.06″
- Vias PTH or filled vias
- Glass passivation or solder mask (various colors)
- Ident: Black, White
- Finish: OSP, silver, ENIG (gold), ENEPIG or ENEG (advised for gold wire bonding)
- Track width: >= 100um
- Spacing: >= 100um
- Delivery in single units or panel with/without laser scribing (more info)
More information:
Design delivery format: Gerber, ODB, DXF/DWG, PDF, Step
Tooling cost might incur.
Lead time: 20-35 working days (depending on design)
Assembly: Reflow/SMT advised, SMT, through hole, wire bonding.
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M-PRO & SPECIALS
beste price or new development
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High volume or recurring program? Need something else? Contact us to discuss.
- Best price needed?
- Higher dimensions? (up to 190mm | 7.5″)
- More thicknesses? (up to 2mm)
- higher layer count: (up to 6)
- Special plating
- Special metalization (AgPt, Au)
- Tighter track width & spacing (80um, 50um or 30um)
- Special builds, hybrid material
- Special material (glass, silicon nitride – Si3N4)
- Circuit on heatsink
- Assembly
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Material properties Aluminum Nitride
| Property | Items | Unit | AlN |
|---|---|---|---|
| Physical | Color | - | Grey |
| Water absorption | % | 0 | |
| Reflectivity | % | 30* | |
| Electrical | Dielectric Constant (1MHz) | - | 8～10 |
| Dielectric Loss | *10^-4 | 3 | |
| Dielectric strength | MV/m or KV/mm | >17 | |
| Insulation/Volume resistance | Ω·cm | >10^14 | |
| Mechanical | Density after sintering (Bulk density) | g/cm3 | 3.26 |
| Flexural Strength (3 point) | Mpa | ～380 | |
| Hardness | 9.3 | ||
| Elasticity (Young's Modulus) | GPa | 302 | |
| Surface Roughness | μm | 0.3～0.6 | |
| Camber | Lenght% | ≦2 | |
| Thermal | Coefficient of Thermal Expansion (CTE) | ppm/°C | 2～3 |
| Coefficient of Thermal Expansion (CTE) RT~500 °C | ppm/°C | 2.5～3.5 | |
| Thermal Conductivity (25°C) | W/m‧K | 170 | |
| * Reflectivity test reference thickness of 0.5mm | |||
Ceramic-PCB by CERcuits is the online order portal from CERcuits, ceramic PCB & substrates. Learn more or contact us in case you have a high volume program or need different/more stringent specifications.
(*) pricing examples based on an Aluminum Nitride PCB using our C-Proto solution with the following specifications: 4 single pieces of 40x40mm – 1 layer – silver conductor – no silkscreen. EUR 430.5 / order has no soldermask – EUR 456.5 / order includes green solder mask. This price is for the full batch but excludes shipping, VAT and other taxes & duties.