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Aluminum Oxide PCB (Alumina)
Aluminum oxide PCB (Al2O3 or Alumina) is today the most widely used ceramic printed circuit board and submounts. This is thanks to its good material properties, namely good thermal conductivity, low CTE (coefficient of thermal expansion), resistance to chemical hazards and hermeticity in combination with a relatively low cost and a more easy handling. Applications include for example cooling and heating modules, LED boards, medical circuits, sensor modules, and high-frequency devices.
The main reasons Alumina is chosen over other printed circuit boards is:
- Higher operating temperature up to 350ºC (using thick film printing)
- Lower expansion coefficient (6-8 ppm/ºC) matching components
- Good thermal properties (22-24 W/mK)
- Superior high-frequency performance
- Smaller package size due to integration and multi-layer possibilities
- High wear and chemical hazards resistance
- Hermetic packages possible, 0% water absorption
- Good light reflection due to white color.
- Limited to no outgassing
- Strong rigid material
At CERcuits, we supply both Aluminum Oxide PCB (Al2O3 96%) made by thick film process (Silver metalization) as well as Direct Plated Copper Technologies (DPC), with copper tracks and pads.
We offer online quoting + ordering and have a solution for you whether you are in your development phase, doing research or moving towards mass production.
Explore our Aluminum Oxide PCB solutions below:
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C-PROTO
Quick turn. Starting at 1 piece!
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The perfect solution for fast turn development, research, prototyping and low to volume programs. Advised for 1-5 panels.
- Max dimensions 90″x80mm | 3.5″ x 3.1″
- Copper (1oz | 35um) or Silver (20um +/- 5) metallization
- Layers: Single sided only
- Thicknesses: 0.38mm, 0.5mm, 0.76mm, 1mm | 0.015″, 0.02″, 0.03″, 0.04″
- Vias PTH (filled or not filled)
- Solder mask: Green, Black & White, Blue (standard or encapsulant)
- Ident: coming soon, laser engraving possible
- Finish: Immersion Tin, Silver, ENIG (gold), ENEG (advised for gold wire bonding)
- Track width: >= 200um / 8 mil
- Spacing: >= 200um / 8 mil
- Delivery in single units or panel with/without laser scribing (more info)
More information:
Design delivery format: Gerber, dxf, dwg, step, pdf, ai, ODB++
Lead time: 5-15 working days. 2-3 days possible
Assembly: suitable for manual soldering, SMT, through hole, wire bonding.
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C-PRODUCTION
More options, higher volume
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Full specifications available. Mostly chosen for Medium to Higher volume programs. Advised from >5-100 panels
- Max dimensions 125x125mm | 5″x5″
- Copper, Silver or Silver-palladium metalization
- Layers: single layer – up to 4 layers
- Thicknesses: 0.38mm, 0.5mm, 0.635mm, 0.76mm, 1mm, 1.5mm | 0.015″, 0.02″, 0.025″, 0.03″, 0.04″, 0.06″
- Vias PTH or filled vias
- Glass passivation or solder mask (various colors)
- Ident: Black, White
- Finish: OSP, silver, ENIG (gold), ENEPIG or ENEG (advised for gold wire bonding)
- Track width: >= 150um / 6 mil
- Spacing: >= 150um / 6 mil
- Delivery in single units or panel with/without laser scribing (more info)
More information:
Design delivery format: Gerber, ODB, DXF/DWG, PDF, Step
Tooling cost might incur.
Lead time: 20-35 working days (depending on design)
Assembly: suitable for manual soldering, SMT, through hole, wire bonding.
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M-PRO & SPECIALS
beste price or new development
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High volume or recurring program? Need something else? Contact us to discuss.
- Best price
- Larger dimensions (up to 190mm | 7.5″)
- More thicknesses options (0.25 | 0.06 or up to 2mm )
- Higher layer count: (up to 6)
- Thicker metalization
- Special plating
- Special metalization (AgPt, Au)
- Tighter track width & spacing (80um, 50um or 30um)
- Special builds, hybrid material
- Special material (glass, silicon nitride – Si3N4)
- Piezo elements
- Circuit on heatsink
- Assembly
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Material properties Aluminum Oxide 96%:
| Property | Items | Unit | Al2O3 96% |
|---|---|---|---|
| Physical | Color | - | White |
| Material - Aluminium Oxide | % | 96% | |
| Water absorption | % | 0 | |
| Reflectivity | % | 94 | |
| Electrical | Dielectric Constant (1MHz) | - | 9-10 |
| Dielectric Loss | *10^-4 | 3 | |
| Dielectric strength | MV/m or KV/mm | >15 | |
| Insulation/Volume resistance | Ω·cm | >10^14 | |
| Mechanical | Density after Sintering (Bulk density) | g/cm3 | >3.7 |
| flexural Strength (3 point) | Mpa | >400 | |
| Surface Roughness | μm | 0.2～0.75 | |
| Camber | Lenght% | ≦2 | |
| Thermal | Coefficient of Thermal Expansion (CTE) | ppm/°C | 6.5-7.5 |
| Coefficient of Thermal Expansion (CTE) RT~500 °C | ppm/°C | 6.5-8.0 | |
| Thermal Conductivity (25°C) | W/m‧K | 24 | |
| * Reflectivity test reference thickness of 1mm | |||
(*) pricing examples based on an Alumina PCB using our C-Proto solution with the following specifications: 4 single pieces of 40x40mm – 1 layer – silver conductor – no silkscreen. EUR 389 / order has no soldermask – EUR 412 / order includes green soldermask. This price is for the full batch but excludes shipping, VAT and other duties.