Ceramic PCB Design Guideline
Introduction
Designing a Ceramic PCB has many similarities but also many differences compared to standard printed circuits boards. It starts with the choice of substrate material and conductor as this will impact almost everything that follows.
In this ceramic PCB design guide we will not only explain to you what choices will enable you to reach what results, but we will also lay out how to best draw your design so it is manufacturable and what you need to bear in mind to improve your design so it is more robust, has a higher yield and lead to a satisfying end results
The index of our design guide is listed below. Every topic will start with general information about how this is done for ceramic circuits and what particularities to consider in your design.
Then we detail what are the specifications we can meet for our C-proto (samples, prototypes, low volume) & C-Production (medium to high volumes) solution

1. Substrates & Conductors
Materials, dimensions, thicknesses & layers, …

2. Designing tracks & pads
Line widths, spacings, pad sizes & positioning,…

3. Holes, vias & interconnects
Filled & plated vias, mounting, screw & positioning holes & slots, …

4. Masking & finishing
Solder masks, encapsulants, surface finishes, …
5. Design files
Data formats, drawings, layers nomenclature, ….

6. Cost & optimization
Significant cost drivers, ways to optimize & simplify
Making a ceramic PCB
Different types of manufacturing, comparing technologies, …