Alumina 96% (Al2O3) is one of the most popular ceramic substrates because of its excellent heat resistance, high mechanical strength, abrasion resistance, and small dielectric loss. The surface of>the alumina substrate is quite smooth and has a low porosity. Alumina 96% substrates are suitable for thick film applications like hybrid PCB and component substrates or it can be used in direct plated copper sputtering. Thanks to its adequate thermal conductivity, it can also be used as a heat spreader at the back of a PCB. It is also suitable for usage in high power and high-frequency applications because of dielectric properties.
Our OCTO brand blank alumina substrates are available in various sizes and thicknesses. Thanks to a large and live inventory, we can ship your part fast for you to start your project. Need higher quantities, contact us here.
For custom sizes or 2D laser machined Alumina substrates, get your quote and order online here.
- high wear & chemical resistance
- heat resistant
- high mechanical strength
- Small dielectric loss
- good thermal conductivity
- high light reflection
- 0% water absorption
- LED lighting
- High-reliability applications
- High-frequency circuits
- Power electronics
- Photovoltaic Technology
- Applications for hazardous environments
Alumina Oxide material properties:
|Material - Aluminium Oxide||%||96%|
|Electrical||Dielectric Constant (1MHz)||-||9-10|
|Dielectric strength||MV/m or KV/mm||>15|
|Mechanical||Density after Sintering (Bulk density)||g/cm3||>3.7|
|flexural Strength (3 point)||Mpa||>400|
|Thermal||Coefficient of Thermal Expansion (CTE)||ppm/°C||6.5-7.5|
|Coefficient of Thermal Expansion (CTE) RT~500 °C||ppm/°C||6.5-8.0|
|Thermal Conductivity (25°C)||W/m‧K||24|
|* Reflectivity test reference thickness of 1mm|
- < 1mm: 0.03mm
- >1mm & <1.5mm: +/- 0.05mm
- >1.5mm: +/- 0.07mm
- +0.25mm / -0.05mm
Frequently asked questions about our blank alumina substrate:
What is the best way to cut ceramic substrates?
Answer: It depends a bit on the shape and precision you are trying to achieve. In general, laser cutting is the best way to do it but be aware that laser cutting is very difficult, you will need a powerful one and conductive residue might be formed at the edges. Alternatives are diamond drills and diamond saws if precision is less a requirement. We have had customers that cut the substrates into shape with a Dremel and a diamond cutting blade. Just make sure you always use cooling or cut small parts at a time.
Last but not least, for straight cuts, you can scribe and cleave the boards using a diamond-tipped scribing pen. It requires a bit of practice but will work well for thinner substrates below 0.635mm (0.030").
However, we do advise you to use our services for proper cut-to-shape ceramic substrates. Take a look at our precision laser cut services.