Aluminum Nitride (AlN) is the best performing ceramic substrate for electronic circuits because of its high thermal conductivity (170 W/mK), low coefficient of thermal expansion (CTE), rigidity and dielectric strength. These properties make it the perfect material for high power circuits for LED/laser application, power management, ultra-low temperature electronics, and many more applications.
If you are looking to test this material and only need a few parts at low cost and lead time. Check out our Aluminum Nitride C-Proto solution.
Ordering a Ceramic PCB
1. Quote & Order
Get your quote and order immediately online. No waiting, no hassle.
Anything unclear or still unsure about something? Contact us anytime!
2. Design check
We will check if your design meets our production specifications and make a panel drawing, if applicable. If something needs to be changed, we will let you know.
After the design is ready and frozen, it is off to the factory. This is where the magic happens...
4. Final check & shipment
As soon as your order is made, it gets send back to our Belgian location for a final quality check. If everything looks good, we'll ship it out to you.
Design rules for our C-Production Aluminum nitride PCB solution:
|C-PRODUCTION DESIGN RULES AlN PCB||Copper (Cu)||Silver (Ag) / Silver-Palladium (AgPd)|
|Max. panel Dimensions (a)*(b)||125mmx125mm||5" x 5"||125mmx125mm||5" x 5"|
|Max. circuit Dimensions (c)*(d)||115mmx115mm||4.5" x 4.5"||115mmx115mm||4.5" x 4.5"|
|Thickness (e)||0.38 | 0.5 | 0.63 | 1.0 mm||15 | 20 | 25 | 39 mil||0.38 | 0.5 | 1.0 mm||15 | 20 | 39 mil|
|Conductor thickness||18 | 35 | 70 | 105 | 140 | 280 um|
(please enquire for other thicknesses up to 350um)
|0.5 | 1 | 2 | 3 | 4 | 8oz|
(please enquire for other thicknesses up to 10oz)
|Layers||Single & double sided||Single & double sided|
|Surface finish||none, OSP, Immersion Ag (Silver) ENIG, ENEPIG (*)||None (Ag, AgPd), ENIG, ENEG (*)|
|Solder resist||green, white, red, blue, black||Glass encapsulant: white, blue, black, high-reflective white|
|Solder resist minimum opening||0.2mm||0.2mm|
|Solder resist minimum pad overlap||0.1mm||0.1mm|
|Silk screen / legend||black, white||black, white|
|Min. line width (a)||0.10 mm (@ 18 or 35um)||6 mil (@ 0.5 or 1 oz)||0.2 mm||8 mil|
|Min. line spacing (b)||0.10 mm (@ 18 or 35um)||6 mil (@ 0.5 or 1 oz)||0.2 mm||8 mil|
|Line/pad to edge spacing (f)||0.2 mm||8 mil||0.2 mm||8 mil|
|Via diameter (c)||0.15mm-0.3mm||6 mil-12 mil||0.15mm-0.3mm||6 mil-12 mil|
|Min. via spacing (b)||0.3mm ||12 mil||0.3mm||12 mil|
|Via/hole to edge spacing||3 x via diameter||0.5mm||20 mil|
|Through hole metallisation||Plated through hole(PTH)||Silver (Ag) Filled vias|
|Min. annular ring diameter (d)||0.2 mm||8 mil||0.2 mm||8 mil|
|Min. annular ring spacing (e)||0.15 mm||6 mil||0.15 mm||6 mil|
|Annular ring to edge spacing (g)||0.15 mm||6 mil||0.15 mm||6 mil|
|Line to hole/via spacing (h)||0.2 mm||8 mil||0.2 mm||8 mil|
|Dimensional tolerance||+/- 0.2mm||+/- 8 mil||+/- 0.2mm||+/- 8 mil|
|Thickness tolerance||+/- 10%||+/- 10%|
|Hole tolerance||+/- 0.1mm||+/- 4 mil||+/- 0.1mm||+/- 4 mil|
|Pad to hole/via tolerance||+/- 0.1mm||+/- 4 mil||+/- 0.1mm||+/- 4 mil|
|Conductor thickness tolerance||+/-15%||+/-20%|
|Line/Space width tolerance||+/-20% or 25µm @ 35um||+/-20% or 1 mil @ 1oz||+/- 50µm ||+/- 2 mil|
|Misalignment (only for double sided)||≤100µm ||≤ 4 mil||≤100µm ||≤ 4 mil|
|(*) suitable for gold wire bonding (ENEG - Electroless Ni, Electroless Au & ENEPIG - - Electroless Nickel, Electroless Palladium, immersion Gold)|
- single units
- panel with laser scribing (click for more info)
- panel without laser scribing
Note: panel X-out: ≤10%
Material properties Aluminum Nitride:
|Electrical||Dielectric Constant (1MHz)||-||8～10|
|Dielectric strength||MV/m or KV/mm||>17|
|Mechanical||Density after sintering (Bulk density)||g/cm3||3.26|
|Flexural Strength (3 point)||Mpa||～380|
|Elasticity (Young's Modulus)||GPa||302|
|Thermal||Coefficient of Thermal Expansion (CTE)||ppm/°C||2～3|
|Coefficient of Thermal Expansion (CTE) RT~500 °C||ppm/°C||2.5～3.5|
|Thermal Conductivity (25°C)||W/m‧K||170|
|* Reflectivity test reference thickness of 0.5mm|
When should I consider ordering via C-proto and when via C-production?
Answer: C-proto is perfect for people that only need a few pieces (5 panels or less => Please note; depending on the size, several PCB may fit on one panel). And the design needs to be relatively simple with only limited options regarding thickness, finish, and masking. The advantage of C-proto is that you can have your PCB relatively fast and at a much lower cost as you do not need to pay for tooling. C-proto orders are made on a specifically designed production line for prototypes and low volume.
C-production orders, on the other hand, will be made on a fully-fledged ceramic PCB production line at one of our partners which are designed for higher volume orders. It gives you many more options and tighter specifications but the downsides are price and longer lead time.
Where are the C-Production orders made?
Answer: We have several production partners in China, Taiwan, India, the USA, and Europe. In order to ensure consistent quality, every order standard passes our Belgian location for a final quality check before it is shipped to you.
Are there any import duties/tariffs that I need to pay?
You are responsible for local import formalities and duties on your order. Note that when you are based in the USA and choose copper metallization, your order will likely be made by our partner in China and is thus likely subject to a 25% tariff.
If you would like to avoid this, please switch to silver metalization (never made in China) or order via C-Proto if possible (made in Belgium). If both options do not suit you, contact us. We have other production partners in Taiwan that are also able to supply copper-based ceramic PCB but we need to quote this separately.
Can you ship faster?
Answer: We might. It depends on the production schedule of our partners. Contact us to discuss this.
How are Ceramic PCBs made?
Answer: we made a page about this that explains the different manufacturing technologies. Find it here.