Aluminum Nitride (AlN) is the best available thermally conductive material (170 W/mK) that is also a strong electric insulator. It is therefore used in a variety of applications where heat needs to be transferred away from a component or circuit. Furthermore, it has a low coefficient of thermal expansions resulting in a close CTE match with other materials like silicon and other ceramics. These characteristics make AlN a perfect material for packages and submounts of power components like power LEDs, high powers IC, high voltage inductors,… More and more it is also used as substrates for ceramic printed circuit boards in high power modules, f.e. IGBT, electronics drivetrains, power management modules, specialty lighting, onboard chargers, … or in environments where a very low operating temperature is needed like quantum computing, superconductors, cryogenically freezers,…
Our OCTO brand blank Aluminum Nitride substrates (AlN) are available in various sizes and thicknesses. Thanks to a large and live inventory, we can ship your part fast for you to start your project. Need higher quantities, contact us here.
For custom sizes or 2D laser machined AlN substrates, get your quote and order online here.
- Great thermal conductivity (170 W/mK)
- Low Coefficient of Thermal expansion (3-4 ppm/C)
- high or very low operating temperature.
- Small dielectric loss
- high wear & chemical resistance
- high heat resistance
- high mechanical strength
- 0% water absorption
- high power LED lighting
- High-reliability applications
- Power electronics
- Photovoltaic Technology
- Quantum computing
- Space and aerospace
- Applications for hazardous environments
Alumina Nitride material properties :
|Electrical||Dielectric Constant (1MHz)||-||8～10|
|Dielectric strength||MV/m or KV/mm||>17|
|Mechanical||Density after sintering (Bulk density)||g/cm3||3.26|
|Flexural Strength (3 point)||Mpa||～380|
|Elasticity (Young's Modulus)||GPa||302|
|Thermal||Coefficient of Thermal Expansion (CTE)||ppm/°C||2～3|
|Coefficient of Thermal Expansion (CTE) RT~500 °C||ppm/°C||2.5～3.5|
|Thermal Conductivity (25°C)||W/m‧K||170|
|* Reflectivity test reference thickness of 0.5mm|
- < 1mm: 0.03mm
- >1mm & <1.5mm: +/- 0.05mm
- >1.5mm: +/- 0.07mm
- +0.25mm / -0.05mm
Frequently asked questions about our blank Aluminum Nitride substrates:
What is the best way to cut ceramic substrates?
Answer: It depends a bit on the shape and precision you are trying to achieve. In general, laser cutting is the best way to do it but be aware that laser cutting is very difficult, you will need a powerful one and conductive residue might be formed at the edges. Alternatives are diamond drills and diamond saws if precision is less a requirement. We have had customers that cut the substrates into shape with a Dremel and a diamond cutting blade. Just make sure you always use cooling or cut small parts at a time.
Last but not least, for straight cuts, you can scribe and cleave the boards using a diamond-tipped scribing pen. It requires a bit of practice but will work well for thinner substrates below 0.635mm (0.030").
However, we do advise you to use our services for proper cut-to-shape ceramic substrates. Take a look at our precision laser cut services.