Silicon Nitride substrates (Si3N4) have the best mix of electrical, thermal, and mechanical properties of any ceramic material. It is the choice of material for applications where other ceramics prove to be too weak to handle mechanical stress or thermal shocks but you still need to handle high current, conduct heat, or withstand chemical hazards. Examples are battery management systems for electrical drivetrains, high-pressure environments like deep-sea sensors, industrial sensors & antennae, portable lighting & scanning solutions, …
Furthermore, the high absorption rate color combined with high thermal conductivity makes it suitable for certain optical applications like photonics where reflections need to be managed while conducting an elevated watt per mm2.
We currently store 1mm and 2mm standard Silicon nitride substrates (30-32 W/mK – black color) as well as 0.32mm high-performance ones (85~95 W/mK – grey color) which are ready to ship immediately. However, if you need a different size or a different thickness, we can still help. Also if you are looking for a high-volume quote, simply contact us for a quote.
Main advantages Silicon Nitride
- high strength over a wide temperature range
- High fracture toughness / flexural strength
- Outstanding wear resistance, both impingement as well as frictional modes
- Good thermal shock resistance (low expansion rate + high thermal conductivity)
- Strong chemical resistance
- high absorption
Silicon Nitride (Si3N4) material properties:
Property | Items | Unit | Si3N4 | Si3N4 (high performance) |
---|---|---|---|---|
Physical | Color | - | Black | Gray |
Warpage | ≤4‰ | |||
Surface Roughness (Ra) | μm | 0.55 | ||
Electrical | Dielectric Constant (10GHz) | - | 8-9 | 8 |
Dielectric Loss | *10^-4 | 25 | ||
Dielectric strength | MV/m or KV/mm | >14 | >15 | |
Insulation/Volume resistance | Ω·cm | >10^10 @ 25°C | >10^14 | |
Mechanical | Density after Sintering (Bulk density) | g/cm3 | ~3.3 | ~3.22 |
Flexural Strength (3 point) | Mpa | ~800 | 700~800 | |
Compressive Strenght | Mpa | ~2500 | ||
Poisson’s Ratio | - | 0.27 | ||
Young’s modulus | GPA | 200-350 | ||
Fracture Toughness | MPa·m1/2 | 6~7 | ||
Hardness | HV | 1500 | ||
Thermal | Coefficient of Thermal Expansion (CTE) | ppm/°C | ~3.3 | ~2.6 |
Max. Temperature | °C | <1150 | ||
Thermal Conductivity (25°C) | W/m‧K | 30-32 | 85~95 |